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Nanofurnace System

The Nanofurnace Deposition System is a state-of-the-art thermal chemical vaporization system with a quartz reactor designed for growing nano deposition materials on a wide variety of substrates. This system is an excellent tool for nano materials metal-oxides, nitrides, metals, and carbon materials such as CNTs and graphene.

Carbon Nanotubes
Graphene Synthesis
ZnO nanowires
Substrate Annealing
Oxidation
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CVD Diamond Research Capabilities

Microcrystalline & Single Crystal Diamond
Other coat
Doped Epilayers & Device Prototyping
Coated
Quantum Centers & NV Research
Plasma on substrate
Diamond Heterostructures & Coatings
Diamond Coatings
Microcrystalline & Single Crystal Diamond
Single Crystal Diamond
Doped Epilayers & Device Prototyping
Diamond structure
Quantum Centers & NV Research
Chamber picture
Diamond Heterostructures & Coatings
Plasma

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Explore live demonstrations and key capabilities of our custom semiconductor deposition equipment.

Blue Wave Semi Pulsed Laser Deposition (PLD) System 2024

The BWS PLD System is a fully customizable state-of-the-art physical vapor deposition system designed for the synthesis of high-quality thin films of metal-oxides, nitrides, and multilayer thin film device research.

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Sputtering Process

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic ions. Sputter deposition is a physical vapor deposition (PVD) method for depositing thin films onto a substrate.

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HFCVD Heater Z and Rotation Stage

Blue Wave Substrate/Wafer rotation products are capable of reaching up to 700°C while rotating up to 10-20 rpm. Compatible with reactive sputtering, PLD, PVD, e-beam and thermal evaporation, PECVD, ALD, in UHV or inert and reactive gas environments.

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In-Depth System Information

1 Applications

  • Carbon Nanotubes
  • Graphene Synthesis
  • ZnO nanowires
  • Substrate Annealing
  • Oxidation

2 Features

  • High temperature quartz tube reactor design
  • Excellent temperature uniformity over T length
  • Thermal Process ranging from RT to 1100°C
  • Mechanical vacuum pump for low pressure TCVD (base pressure better than 5E-2Torr)
Liquid bubbler for liquid precursors
Automated process pressure controller
Auxiliary gas mass flow controllers
Accessories coming soon. Contact us for compatible components and add-ons.
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Technical Specifications

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