Sputtering System
The BWS Sputtering System is a fully customizable state-of-the-art physical vapor deposition (PVD) system designed for the synthesis of high-quality thin films across a wide range of applications. Engineered for versatility and reliability, this system delivers exceptional performance for both research and industrial applications, at affordable prices.
The BWS Sputtering System is equipped with a modular design, featuring a customizable stainless steel reactor chamber for efficient and flexible thin-film deposition. With options for up to three sputtering guns, the system provides a robust platform for material deposition. The system also includes a highly adaptable substrate heater capable of reaching temperatures of up to 800°C (900°C for fixed designs), ensuring precise control over film properties. The BWS Sputtering System is ideal for the deposition of a wide array of materials, including oxides, nitrides, and metals. Additionally, it is customizable to support machine learning, automation, and integration with artificial intelligence systems. Typical deposition rates vary depending on the material and process.
Request a QuoteApplications
Optical Transparent Coatings
Oxide and Nitride Coatings
Dielectric (Low and High k) Coatings
Metallic Coatings
Multilayer Thin Films
Semiconductor Device Fabrication
Product Description
1 High-Vacuum Stainless Steel Deposition Chamber
- The vacuum chamber is constructed from 304L stainless steel and engineered to sustain a high-vacuum environment.
- The vacuum chamber is subjected to leak testing with helium at a minimum of 10-9 mbar-L/sec.
- The baseline pressure for a properly conditioned, clean, dry, and evacuated chamber is less than 5 × 10-7 Torr.
- The vacuum chamber contains ConFlat ports and flanges, which are predominantly sealed with copper gaskets. In some locations, flanges are fitted with Viton gaskets to facilitate easier removal and sealing.
- Spare ports are supplied and will be sealed with blank flanges.
- The design provides seamless and rapid access to any section within the internal volume of the chamber.
- Repetitive batch processing involving multiple substrates for depositions.
- Enables easy loading and unloading of sample holders and target materials.
- Suitable flange ports are designated for the turbo molecular vacuum pump, sputter gun assembly, vacuum gauge, sample holder, windows, as well as access to sample loading and accessories.
2 System Framework
- A clean room-grade frame designed for mounting the chamber.
- Contains rack mount panels that hold all system electronics and the power distribution unit.
- Includes caster wheels and leveling pads.
3 Chamber Pumping
- Includes an integrated Turbo Pump.
- Includes a mechanical dry pump serving as a backing pump to achieve a rough vacuum.
- Includes all relevant hardware, vacuum plumbing, and valves necessary for pumping and venting operations.
- Maximum reliability within a compact design.
- High pumping speed and maximum compression for all gases.
- Integrated drive electronics, appropriate for industrial settings.
- Continuous monitoring of operational data.
4 Dry Mechanical Pump
- Oil-free scroll pump to prevent any hydrocarbon oil fumes that could contaminate the process.
- Oil-free maintenance for the pump.
5 Gas Flow Control for Process Stabilization and Pressure Optimization
- The combination of gas flow and turbo pump speed can be utilized for the optimization of sputtering process pressure. Blue Wave Semiconductors offers gas flow meters (Please see the specification table).
6 Vacuum Gauges
- Includes a full range vacuum gauge and a process vacuum gauge.
- The full range gauge measures from atmospheric pressure to 10-9 Torr.
- The process gauge enables accurate pressure measurements during operation.
- Both gauges contain a digital pressure readout.
- Includes all mounting hardware and cables.
- Easy to operate and clean, resisting metal and oxide contamination over extended use.
7 Sputtering Gun(s) and Power Supply(s)
- Contains customer specified Sputtering Gun(s). (Please see the specification table)
- Contains power supply(s): RF and/or DC Power Supply. (Please see the specification table)
- Generator, Matching Network, and Controller Included.
- Analog or Serial Interface
- Auto/Manual Operation
- Water flow interlock included.
- Shutter for pre-sputter process.
8 Substrate Mounting and Rotation
- Substrates are affixed to the platen using clicks.
- The substrate rotates at 10 RPM. (Optional rotation speed available)
- Samples are manually loaded through the chamber door.
- Substrate heater option available.
9 Water Cooling
- Components that necessitate water cooling will be directed to a shared flow indicator located near the rear of the assembly. The customer will be responsible for supplying cooling water (inlet/outlet) to the rear bulkhead fitting.
- A water flow sensor for the interlock will be included with this assembly. The customer is responsible for providing the applicable components, which may include a chiller, compressors, controllers, tubing, clamps, etc.
10 Semi-Automated Operation
- The system can be operated entirely in manual mode. Additionally, it can function in semi-automated mode utilizing recipe-based programming. A Windows-based computer equipped with software for real-time data display, monitoring, and logging is provided for ease of use.
Optional Upgrades
OP-1. Additional Gas/Mass Flow Controller
Contact Blue Wave for additional mass flow controller selection.
OP-2. Rotation Speed Adjustment
Enables the substrate holder to operate at variable speeds.
OP-3. Substrate Heater and Temperature Controller
The substrate holder may be upgraded to incorporate a Blue Wave brand Inconel substrate heater
for precise substrate temperature regulation and monitoring.
The substrate heater operates at
a maximum temperature of 600˚C, with a temperature uniformity of within 10%. Additionally,
it includes a stainless-steel shield equipped with six 4-40 tapped holes for sample
clamping.
The substrate heater element is sealed against exposure to reactive gases and
plasma deposition.
Includes a Blue Wave temperature controller that precisely manages the
substrate heater temperature and provides it with power while providing the temperature
readings.
OP-4. Z-Travel for Substrate Fixture
2-inch in-situ vacuum movement of the substrate.
Contains a digital display of the distance
moved.
OP-5. Load Lock Wafer Transfer Mechanism
A chamber isolated with a gate valve that allows for in-situ sample transfer.
Contains an
additional vacuum gauge for load lock pressure readings.
Contains a sample loading arm.
OP-6 Add Pulse Laser Deposition, Electron Beam Evaporator, or Thermal Evaporator
The sputtering chamber can integrate with other CVD systems. Contact Blue Wave Semiconductor for more information.
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We’re updating the contents on this page, please check back again soon!
Technical Specifications
Product Specification
| Specification | Parameter |
|---|---|
| Vacuum With Turbo Pump | 1 × 10-6 Torr |
| Process Pressure Control Range | 1 × 10-4 - 10 Torr |
| Substrate Temperature Range | Up to 800°C (900°C for fixed design) |
| Gas Flows (MFCs) | - Argon (Ar): 0 - 200 SCCM (Customizable) - Optional additional MFCs |
| System Input Power | One 220 VAC 1Φ power source (Customizable) |
| DC Power Supply | 750 Watt (Customizable) |
| RF Power Supply | 300 Watt (Customizable) |
| Vacuum Pump | Dry Pump |
| Mechanical Pump Speed | 15 m3/hr |
| Turbo Pump Speed | 250 L/s |
| Cooling | Water Cooling |
| Vacuum Seals | Viton Gaskets, Copper Gaskets |
| Deposition Area | .5” to .6” Diameter |
| Deposition Rate | ~2 nm/min to ~100 nm/min (depending on material and process) |
| Substrate Holder | Stainless Steel |
| System Chamber | Stainless Steel |
| Interlock Control | - Over Pressure Protection - Heater Over-Temperature Protection - Vacuum Safety System - Water Flow - Emergency Stop |
| System Size | - Width: 3 ft - Depth: 3 ft - Height: 5 ft |