1 High-Vacuum Deposition Chamber

• The chamber is constructed from PYREX glass with a 16-inch diameter and 20-inch height, providing a see-through high‑vacuum environment.
• The system achieves a base pressure better than 3×10⁻⁶ Torr when clean, dry, and properly conditioned.
• Designed for easy and fast access to the full internal chamber volume, enabling efficient workflow during deposition processes.
• Supports repetitive batch processing with simple loading and unloading of substrates, evaporation materials, and sources, while allowing clear visual monitoring during operation.
• Equipped with well‑designed flange ports for the turbo‑molecular pump, evaporation assembly, vacuum gauge, substrate holder, sample‑loading access, accessories, and optional substrate heating.
• Engineered for thin‑film research, prototype device fabrication, and deposition of metals, optical coatings, selective oxides, and polymer materials.

2 System Framework

• A robust clean room-grade frame designed for holding the chamber and system components.
• Integrated rackmount mounting for electronics, power distribution, and control systems.
• Equipped with mobility and leveling features for easy installation and adjustment.

3 Chamber Pumping:

• Includes an oil mechanical pump capable of achieving high vacuum levels better than 9×10⁻³ Torr.
• A turbo pump will further pump down the chamber, achieving high vacuum levels better than 3×10⁻⁶ Torr.
• Includes all relevant hardware, vacuum plumbing, and valves necessary for pumping and venting operations.
• Compact, efficient design optimized for stability and long-term use.

4 Oil Mechanical Pump:

• High-performance rotary vane oil pump optimized for process stability.
• Equipped with an isolation valve to protect against back-streaming.

5 Vacuum Gauge

• Utilizes a full‑range vacuum gauge capable of measuring from atmospheric pressure down to 1×10⁻⁸ Torr
• The gauge contains a digital pressure readout.
• Includes all mounting hardware and cables.
• Easy to operate and clean, resisting metal and oxide contamination over extended use.

7 Thermal Evaporation Source

• A high‑current evaporation source assembly equipped with tungsten filament and robust feedthroughs for stable deposition performance.
• A dedicated power supply designed to deliver the required current for reliable source heating.
• A manually operated shutter positioned over the substrate to control deposition exposure.
• Integrated shielding to minimize cross‑contamination during evaporation processes.

8 Substrate Holder/Adjustment

• A mechanically clamped substrate holder designed to support wafers up to 4 inches in diameter securely.
• Operates at room temperature with an option to integrate a substrate heater for expanded process capability.
• Allows quick and simple clamping and removal of samples for efficient workflow.

10 Computer Control

Includes a computer equipped with custom software, which includes, but is not limited to:

• Vacuum measurements
• Power control and monitoring
• Thickness measurement (If selected)
• Adjustable safety interlocks